POEA Job Position: Wire Bond Engineer

Location: Malaysia

Employer/Company: Carsem Sdn. Bhd.

Qualifications:

• Male Applicants
• Experience in a semiconductor manufacturing environment
• Experience in the Wire Bonding area will be an added advantage.
• Good communication and analytical skills

Job Responsibilities:

• Train, motivate and supervise a team of technicians to achieve
• Provide technical solutions to process issues.
• Develop and Monitor Yield, Quality, Productivity Improvement Activities and Cost Reduction Programs.
• Develop new processes and sources for materials, and equipment for continuous breakthrough improvement.
• Review and ensure customers’ specifications have been complied with.

Requirements:

• Passport
• RESUME with 2×2 picture
• NC2 Domestic Work Certificate
• Employment Certificate